?Passive heatsinks for the ICS series enable the finished devices to be used even in thermally demanding applications.
?Extensive thermal simulations help achieve the optimum arrangement of components on the printed circuit board.
?Customized heatsinks ensure reliable heat dissipation.
?If you want to find out more please visit https://phoe.co/ics-thermal-management
?Subscribe to our YouTube Channel to get the latest news and updates: https://phoe.co/subscribe
